SiC Phaj rau ICP Etching

Feature Requirements: Optimized for Demanding Plasma Environments

To meet the stringent demands of ICP etching environments, the SiC plate must possess the following core characteristics：

● Excellent Thermal Conductivity

SiC has extremely high thermal conductivity, far exceeding that of traditional materials such as quartz or alumina. This means that it can efficiently conduct heat generated during the etching process away from the wafer, effectively preventing local overheating.

kev pab cuam: Ensure uniform temperature across the wafer surface, resulting in highly consistent etch depth and critical dimension (CD) control, significantly improving yield and reducing wafer scrap.

● Superior Plasma Shock Resistance

In the plasma environment of ICP etching, the material will face high-energy ion bombardment and chemical corrosion of active free radicals. SiC has excellent plasma resistance, especially in fluorine- or chlorine-containing etching gases.

kev pab cuam: Greatly extend the service life of the wafer carrier, reduce replacement frequency and downtime, thereby reducing operating costs and improving equipment utilization. At the same time, stable material properties also reduce the risk of particle contamination.

● Outstanding Temperature Uniformity

Combined with its high thermal conductivity and low coefficient of thermal expansion, SiC carriers are able to maintain excellent temperature uniformity across the entire wafer surface. This is critical for precise etching, especially for sensitive materials such as GaN.

kev pab cuam: Ensure consistent etching for each device, minimize device performance variations, and provide superior quality and reliability for your LED products.

These performance features are essential for achieving repeatable and precise etching in LED wafer fabrication.

Why Choose Semixlab: Tailored Solutions. Trusted Quality

Choosing Semixlab means you choose performance, reliability and customized services:

1. A variety of specifications are available, and customized services are provided:

We are well aware that different ICP etching equipment and processes have unique requirements for wafer carrier size, hole position, and clamping method. Semixlab provides a variety of standard specifications of SiC wafer carriers to meet the mainstream market needs.

More importantly, we provide professional customization services. Whether you need special sizes, complex structural designs, or optimization for specific processes, our engineering team can work closely with you to provide tailor-made solutions. This means you can get a carrier that perfectly matches your equipment and process, maximizing production efficiency and yield.

2. Stable Quality & Rapid Delivery

Our rigorous quality control system ensures consistency across batches, while our efficient manufacturing and logistics guarantee fast lead times, helping you meet tight production schedules.

Trust Semixlab – Your SiC Material Partner in Advanced Plasma Etching

With years of experience serving the semiconductor coating industry, Semixlab combines deep material expertise, state-of-the-art processing, and customer-focused service to deliver components that enhance process stability and product quality.

Application: Engineered for ICP Etching in the LED Industry

In the advanced LED manufacturing process, ICP (Inductively Coupled Plasma) etching is a critical step for achieving precise micro-patterning on semiconductor wafers. Semixlab’s SiC plate functions as a highly reliable wafer carrier or holder during the ICP etching process. Its robust material properties ensure process stability even under extreme plasma conditions, making it an essential component for high-yield, high-uniformity LED production lines.