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CMP polishing abrasive
| Qhov chaw ntawm keeb kwm: | Tuam Tshoj |
| Hom Npe: | Semixlab |
| Model Number: | SXL-1 |
| Certification: | ISO14001, ISO45001, ISO9001 |
| Yam Tsawg Tshaj: | Yuav tsum tau sib tham ua ntej |
| Nqe: | Tiv tauj rau Kev Hais Tus Nqi Tshwj Xeeb |
| Ntim Paub meej: | Pob khoom xa tawm txheem |
| Tus me nyuam lub sij hawm: | 15-30 Days After Order Confirmation |
| Ntsiab lus uas them: | T / T |
| Mov Muaj peev xwm: | 10 tons / Lub Hlis |
Hauj lwm
CMP (Chemical Mechanical Planarization) polishing abrasive is a key material in the fields of semiconductor manufacturing, optical glass, integrated circuits, etc., and achieve nano-level surface flattening through the synergistic effect of chemical corrosion and mechanical grinding.
daim ntawv thov:
CMP polishing abrasives are crucial key materials in the field of integrated circuit manufacturing and can be used in integrated circuit ILD, semiconductor monocrystalline silicon wafers, semiconductor silicon carbide, integrated circuit shallow trench isolation (STI), integrated circuit polysilicon (Poly - Si), integrated circuit metals and metal barrier layers.
Cov kev pabcuam uas muab tau:
kev tshuaj xyuas qhov xwm txheej ntawm cov neeg siv khoom siv, cov ntaub ntawv sib phim, kev daws teeb meem kev siv tshuab.
Tuam txhab profile:
Semixlab muaj 2 lub chaw soj nstuam, ib pab neeg kws tshaj lij nrog 20 xyoo ntawm kev paub txog khoom siv, nrog R&D thiab kev tsim khoom, kev sim thiab kev txheeb xyuas.
Specifications
Performance Indicators for Ultra-High Purity Series Products
| parameter | SXL-1 | SXL-2 | SXL-3 | SXL-4 | SXL-5 | SXL-6 | SXL-7 |
| Average SilicaParticle Size/nm | 35 ± 5 | 45 ± 5 | 65 ± 5 | 75 ± 5 | 85 ± 5 | 100 ± 5 | 120 ± 5 |
| Nanoparticle SizeDistribution (PDI) | |||||||
| Kev daws pH | 7.2-7.4 | 7.2-7.4 | 7.2-7.4 | 7.2-7.4 | 7.2-7.4 | 7.2-7.4 | 7.2-7.4 |
| Solid Content/% | 20.5 ± 0.5 | 20.5 ± 0.5 | 20.5 ± 0.5 | 20.5 ± 0.5 | 20.5 ± 0.5 | 20.5 ± 0.5 | 20.5 ± 0.5 |
| tsos | Lub teeb xiav | Blue | Dawb | Tawm Dawb | Tawm Dawb | Tawm Dawb | Tawm Dawb |
| Particle Morphology X | X:S- pherical;B- Curved;P- Peanut-shaped;T- Bulbous;C- Chain-like (aggregated state) | ||||||
| Stabilizing Ions | Organic/Inorganic Amines | ||||||
| Raw material Composition Y | Y:M-TMOS;E-TEOS;ME-TMOS+TEOS;EM-TEOS+TMOS | ||||||
| Metal Impurity Content | ≤ 300 hli | ||||||
daim ntawv sau npe
Cov teb tseem ceeb ntawm daim ntawv thov
| Daim ntawv thov kev taw qhia | Yam xwm txheej |
| Semiconductor Manufacturing | Integrated Circuit (IC) Chips and Third Generation Semiconductor Materials |
| Optics and Display Technology | Optical glass, lens and display panel |
| Cia Khoom Li | Hard disk platters and 3D NAND flash memory |
| Advanced Ntim | Wafer-level packaging (WLP), TSV (through silicon via) |
| Other high-end applications | MEMS (Micro-Electro-Mechanical Systems) and Medical Implants |
Kev pom zoo rau kev txheeb xyuas cov saw hlau ecological
Semixlab CMP polishing abrasives meet the semiconductor industry certification and have passed the ISO 14001/45001/9001 certification
Cov txheej txheem thov ib txwm muaj
Raw material → Abrasive Synthesis (Surface modification)→ Slurry Formulation (Filtration/PH adjustment)→ CMP polishing (EPD control)→ Post-Clean → Inspection (AFM/KLA)→ Data Feedback Optimization
Through process parameter optimization, Semixlab CMP polishing abrasive has achieved breakthrough progress in the field of domestic high-end semiconductor integrated circuit, gradually replaced imports in the semiconductor market, and has been successfully applied to the production and manufacturing of LCD, OLED and other display panels. If you need to obtain detailed technical white papers or arrange sample testing, please contact our technical support team.
Kev Tshaj Loj (Competitive Advantage)
Semixlab CMP polishing abrasive core advantages
a.Freely adjustable particle diameter and degree of particle aggregation;
b.Monodisperse particles with uniform particle size distribution;
c.Stable dispersion system;
d.Large-scale production capability with minimal batch-to-batch variation;
e.Highly stable, resistant to agglomeration and sedimentation.
peb pab
Semixlab khoom khw
Semixlab CMP polishing abrasive shops
